The defect of cell phone jammer should be removed carefully

Purchase many of today's chip set is to reduce the number of ESD protection circuits. In other words, these chipsets in a user-generated ESD events from damage under the capacity is declining. Almost all of the chip set has on-chip ESD protection. ESD circuitry on the chip periphery and adjacent I / O pad Department, which is used in wafer fabrication and assembly processes to protect back-end chip set. In these environments, ESD equipment or plant by production-line workers introduced into the chipset. The key specifications include Human Body Model ESD (HBM), Charged Device Model (CDM) and Machine Model (MM). The defect of cell phone jammer should be removed carefully.
The purpose of these tests is to ensure that specifications chipset in the manufacturing environment to maintain high manufacturing yields. Traditionally, chip makers have been trying to maintain the required 2,000 V HBM levels. From the perspective of cost-benefit ratio, which has been proven to be a very difficult to do. It can be seen from Figure 1, with the 90nm manufacturing technology into the following, the ESD protection levels are maintained at the cost of 2,000 V, has begun to increase exponentially. So, now the new goal is to reduce the level of on-chip ESD protection, but maintain the same level of high manufacturing yield. Is now generally accepted critical ESD protection level of about 500V. At this level, the chip costs were more reasonable, yield levels are not compromised. This is because the typical wafer fab and assembly plant there will be limited to 500V or less ESD policy. The challenge also means the new chance for the    cell phone jammer      workshop.
Therefore, even if all of the chip set on the die contains ESD protection circuitry, and its purpose is only to ensure high manufacturing yield. However, this level of ESD protection is insufficient to protect the chip set from the actual use of cell phone consumers will encounter when serious damage to ESD events. Control can not be pre-consumer environment, you must use a different standard for ESD protection. This is the IEC 61000-4-2. The IEC standard has been applied by many manufacturers (cell phones, smart cell phones, MP3 players, etc.) used to ensure that their products work reliably and not be subject to early failure. The specification of the ESD protection level is much higher, due to Littelfuse, Inc. business and technology development manager Jim Colby. HBM test specifications focus on 500V. The research report of        cell phone jammer should contain any detail of the research.
On the other hand, IEC air discharge method in the test requirements may exceed 15,000 V. This means that, in the chipset of ESD protection and reliability required by the test application exists between the level of a very large gap. This usually means that board-level ESD devices (such as multilayer varistors, polymer ESD suppressor and Silicon Protection Arrays) must fill this gap. A point to note is that these technologies ESD protection performance is different. Specifically, on-time and clamping voltages vary widely. This means that the chipset is sensitive, it is possible to use a certain technology applications which can not be through the ESD test, but using a different technique by Shi ESD testing. The industry's most popular board-level ESD protection devices have the following three, their key attributes are as follows. The customer wanna the copy of the presentation of    cell phone jammer      .